THREE-DIMENSIONAL WAFER-SCALE INTERCONNECT AND PACKAGING USING PHOTOSENSITIVE GLASS-CERAMIC SUBSTRATES

Award Information
Agency:
Department of Defense
Branch:
Air Force
Amount:
$50,000.00
Award Year:
1987
Program:
SBIR
Phase:
Phase I
Contract:
N/A
Agency Tracking Number:
6437
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Space Computer Corp.
Po Box 5937, Sherman Oaks, CA, 91413
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
N/A
Principal Investigator
 William J Jacobi
 (818) 981-8740
Business Contact
Phone: () -
Research Institution
N/A
Abstract
N/A

* information listed above is at the time of submission.

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