A 200 MHz Bandwidth, 4096 Spectral Channels, 3 W Power Consumption, Digital Auto-Correlation Spectrometer Chip for Spaceborne Microwave Radiometers

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNG04CA83C
Agency Tracking Number: 034449
Amount: $69,994.00
Phase: Phase I
Program: SBIR
Awards Year: 2004
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
742 Foothill Blvd., Suite 2 B, LA Canada, CA, 91011
DUNS: 147336275
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Constantin Timoc
 Principal Investigator
 (818) 952-0126
Business Contact
 Constantin Timoc
Title: Business Official
Phone: (818) 952-0126
Email: ctimoc@aol.com
Research Institution
NASA?s program for Exploration of the Solar System requires high-resolution microwave spectrometers for the analysis of chemical composition and physical properties of solar system atmospheres. The anticipated results of the proposed R/R&D effort (Phase I and II), if the project is successful, are to demonstrate experimentally the first digital auto-correlation spectrometer on a single chip for spaceborne microwave radiometers with the following important characteristics: (a) a bandwidth of 200 MHz, (b) 4096 spectral channels for high-resolution spectroscopy, (c) less than 3 W power consumption, (d) a mass of less that 800 grams, and (e) a space-qualifiable design and fabrication technology. The innovative approach proposed for achieving these significant objectives consists of a synergistic combination of the following: (a) a unique parallel architecture that will reduce the operating clock frequency, relative to a single-stream architecture, by a factor of 2 and consequently will lower significantly the power consumption, (b) novel differential analog and digital circuits that will improve robustness while operating in the presence of total dose natural radiation found in the space environment, and (c) an advanced 0.13 um CMOS fabrication process available from IBM for manufacturing high-performance, low-power, reliable, and robust (total dose radiation and latch-up resistant) space-qualifiable chips.

* Information listed above is at the time of submission. *

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