A Digital Correlation Spectrometer Chip with 1 GHz Bandwidth, 4096 Spectral Channels, and 4 W Power Consumption for Passive Microwave Remote Sensing Instruments

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNC06CB24C
Agency Tracking Number: 053139
Amount: $70,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solicitation Year: 2005
Solicitation Topic Code: S6.06
Solicitation Number: N/A
Small Business Information
Spaceborne, Inc.
742 Foothill Blvd., Suite 2 B, La Canada, CA, 91011-3441
DUNS: 147336275
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Constantin Timoc
 Principal Investigator
 (818) 952-0126
 ctimoc@aol.com
Business Contact
 Constantin Timoc
Title: Business Official
Phone: (818) 952-0126
Email: ctimoc@aol.com
Research Institution
N/A
Abstract
NASA's future Earth-Sun System missions require the rapid development of small, low-cost remote sensing instruments for the analysis of chemical and physical properties of planetary atmospheres. The objective of the proposed project (Phases I and II) is to research, develop, and demonstrate the first space-qualifiable digital correlation spectrometer on a single chip which, if successful, will reduce the risk, cost, size, and development time of microwave spectrometers and will enable space-science observations measurements that were not previously possible. The innovative approach proposed for achieving the objective consists of a synergistic combination of the following: (a) a unique parallel architecture that will reduce the operating clock frequency, relative to a single-stream architecture, by a factor of 2 and consequently will lower significantly the power consumption, (b) novel differential analog and digital circuits that will improve robustness while operating in the presence of total dose natural radiation found in the space environment, and (c) an advanced 0.13 um CMOS fabrication process with cooper interconnect, available at relatively low-cost through the MOSIS fabrication facility from IBM, for manufacturing high-performance, low-power, reliable, and robust (total dose radiation and latch-up resistant) space-qualifiable chips.

* information listed above is at the time of submission.

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