Improved Radio Frequency (RF) Polymer Substrates for Antennas

Award Information
Agency:
Department of Defense
Branch:
Air Force
Amount:
$749,999.00
Award Year:
2008
Program:
SBIR
Phase:
Phase II
Contract:
FA8650-08-C-5016
Agency Tracking Number:
F071-134-2325
Solicitation Year:
2007
Solicitation Topic Code:
AF071-134
Solicitation Number:
2007.1
Small Business Information
SPECTRUM MAGNETICS, LLC
318 Mourning Dove Dr., Newark, DE, 19711
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
Y
Duns:
361961126
Principal Investigator
 Michael Bonder
 Research Scientist
 (302) 588-6147
 Bonder.sml@comcast.net
Business Contact
 Jianrong Lin
Title: President
Phone: (302) 389-9808
Email: spectrum_magnetics@comcast.net
Research Institution
N/A
Abstract
Based on multiple technology platforms and theoretical analyses, in the Phase I program we have demonstrated the feasibility that RF polymers with desirable high frequency properties can be achieved. Following Edison¡¯s model of product and process development for technology innovations, Phase-II will pursue further incremental improvement in material properties upon the concept-proving material platforms to achieve high and matched dielectric permittivity and magnetic permeability with a low loss tangent in GHz frequency range; the process development work will further optimize the scalable fabrication procedures for quality manufacturing of nanostructured materials with a commitment of pilot scale capacity in place. Leveraging on Spectrum Magnetics' expertise in large-scale fabrication of nanomaterials and know-how in the research of magnetodielectric materials, the team has essential ingredients and catalysts to successfully push this significant technology innovation to marketplace, to satisfy the Air Force needs in next generation antenna development with much improved functionalities in miniaturization, impendence matching, and bandwidth. For civilian applications, initial marketing products have been strategically selected to generate pinpoint entry for this technology innovation.

* information listed above is at the time of submission.

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