DEVELOPMENT OF NOVEL CURING TECHNIQUES FOR THERMOSETTING POLYMERS AND ADHESIVES

Award Information
Agency: Department of Defense
Branch: Army
Contract: N/A
Agency Tracking Number: 9140
Amount: $298,776.00
Phase: Phase II
Program: SBIR
Awards Year: 1991
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
Springborn Materials Science
10 Springborn Ctr, Enfield, CT, 06082
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Dr Bernard Baum
 (203) 749-8371
Business Contact
Phone: () -
Research Institution
N/A
Abstract
THE MAIN OBJECTIVE OF THIS PROGRAM IS TO DETERMINE THE FEASIBILITY OF DEVELOPING A THERMOSETTING POLYMERIC ADHESIVE AND CURING METHOD THAT WILL NOT REQUIRE CURE CYCLES IN AN OVEN OR A PRESS AT ELEVATED TEMPERATURES AND PRESSURES. THE PROGRAM WILL ENCOMPASS A STUDY OF THE RESPONSIVENESS OF THERMOSETTING EPOXY ADHESIVES TO DIELECTRIC, INDUCTION, ULTRASONIC, ULTRE-VIOLET, AND INFRARED ELECTROMAGNETIC ENERGIES. ENERGY SENSITIZERS WILL BE INVESTIGATED FOR IMPROVING THE ADHESIVE'S RESPONSIVENESS TOWARDS ENERGIES SHOWING LIMITED EFFECTS. A FINAL EVALUATION OF THE PHYSICAL PROPERTIES RELATING TO THE CURE OF THE ADHESIVE WILL BE USED TO DETERMINE FEASIBILITY OF DEVELOPING A NOVE CURING THERMOSETTING POLYMERIC ADHESIVE.

* information listed above is at the time of submission.

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