STTR Phae II: Rapid Nondestructive Residual Stress Characterization of Semiconductor Materials

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0450704
Agency Tracking Number: 0319448
Amount: $494,436.00
Phase: Phase II
Program: STTR
Awards Year: 2005
Solicitation Year: 2002
Solicitation Topic Code: EL
Solicitation Number: NSF 02-056
Small Business Information
3002 Progress Road, Madison, WI, 53716
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Jon Lesniak
 (608) 224-1230
Business Contact
 Jon Lesniak
Phone: (608) 224-1230
Research Institution
 Univ. of IL-Urgana-Champaign
 Thomas J Mackin
 1901 South First St., Suite A
Urbana, IL, 61801
 (217) 244-1016
 Nonprofit college or university
This Small Business Technology Transfer (STTR) Phase II research project aims to introduce a series of instruments to the microelectronics industry that allow rapid, high resolution residual stress inspection, defect location and quantification. In silicon wafer manufacture, small cracks may appear at the beginning of the wafer process and must be located to avoid adding value to damaged wafers. In semiconductor wafer bonding, de-bond defects may result from trapped dust particles and gas bubbles resulting in reliability and performance degradation. The infrared grey-field polariscope was able to locate these defects and quantify the residual stress state using a laboratory-based system. Now, this technology will be interfaced with optimized detectors to improve defect resolution and introduced onto a microscope platform to improve inspection of smaller defects. Finally, these stress analysis tools will be integrated into an automated inspection system that will be applicable to on-line inspection of the above-mentioned defects. The profitability of many devices and processes can be significantly hindered by low process yields. Yields can be improved with process control tools that catch stress variations immediately, and customer satisfaction and device reliability improvements made by implementing affordable 100% inspection to eliminate all damaged devices. In addition to making our nation's microelectronics industry more competitive, this tool will advance the state of scientific knowledge by improving resolution limits and provide quantitative measurements for researchers who study semiconductor substrates, wafer bonding, MEMS and integrated circuits.

* Information listed above is at the time of submission. *

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