MMIC Coatings and Encapsulation for Non-Hermetic, Low Cost, Transmit/Receive Modules with the Reliability of Hermetic Packaging

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00178-04-C-3099
Agency Tracking Number: N041-058-0904
Amount: $99,900.00
Phase: Phase I
Program: SBIR
Awards Year: 2004
Solicitation Year: 2004
Solicitation Topic Code: N04-058
Solicitation Number: 2004.1
Small Business Information
1619 Garnet Street, Broomfield, CO, 80020
DUNS: 100363857
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Ofer Sneh
 President
 (720) 887-8166
 ofer@sundewtech.com
Business Contact
 Ofer Sneh
Title: President
Phone: (720) 887-8166
Email: ofer@sundewtech.com
Research Institution
N/A
Abstract
The objective of this SBIR project is to develop a protective overcoat passivation process for wafer-level sealing of Monolithic Microwave/Millimeter wave IC (MMIC). The scarce supply of hermetic packaging choices and the high cost of mil-spec integrated circuit (IC) components used in military and aerospace applications have sparked research focused on using commercial off-the-shelf (COTS) packaging, such as plastic encapsulated microcircuit (PEM), while maintaining hermetic packaging reliability. Atomic layer deposition (ALD) grows continuous, pinhole-free and low-stress films with complete conformality to any surface topology. Such properties render ALD films ideal candidates for wafer-level protection of ICs. A low-cost alternative passivation process to the standard silicon oxide-silicon nitride process will be developed. Low temperature processing and thin films would be used to minimize impact on device reliability and RF performance. A thin film stack with hermetic-like performance would be developed during Phase I. Coated wafers will be die mounted and highly accelerated stress tested (HAST). During Phase I option a suitable ALD system for deposition of encapsulating wafers on MMICs will be designed. System integration and device-level validation will be performed at Phase II, as well as process integration and equipment refinement leading to commercial availability.

* Information listed above is at the time of submission. *

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