MMIC Coatings and Encapsulation for Non-Hermetic, Low Cost, Transmit/Receive Modules with the Reliability of Hermetic Packaging
Small Business Information
SUNDEW TECHNOLOGIES, LLC
1619 Garnet Street, Broomfield, CO, 80020
AbstractThe objective of this SBIR project is to develop and commercialize a protective overcoat passivation process for wafer−level sealing of Monolithic Microwave/Millimeter wave IC (MMIC). The scarce supply of hermetic packaging choices and the high cost of mil−spec integrated circuit (IC) components used in military and aerospace applications have sparked research focused on using commercial off−the−shelf (COTS) packaging, such as plastic encapsulated microcircuit (PEM), while maintaining hermetic packaging reliability. ALD-Cap is a novel wafer level encapsulation technology that is suitable for hermetic-like protection of MMIC devices. ALD-Cap employs Atomic Layer Deposition (ALD) to deposit a film-stack that is optimized to adhere to the MMIC and to provide a defect-free barrier for moisture and corrosion. A successful phase I project was focused on the development of ALD-Cap, the demonstration of wafer level encapsulation using ALD-Cap and the evaluation of cost factors. Phase II project will be focused on the refinement of ALD-Cap film stack, the ALD process and equipment and the integration of ALD-Cap into MMIC fabrication process-flow to achieve low-cost, manufacturable MIL-STD 883E MMIC devices in non-hermetic configuration. Sundew Technologies collaborates with leading MMIC manufacturers to commercialize ALD-Cap and incorporate the technology into MMIC production lines. During follow-on Phase III an ALD-Cap system product will be offered to DoD key components, prime contractors and the private commercial market.
* information listed above is at the time of submission.