Mitigating Lead-Free Issues in Electronic Circuit Board Manufacturing and Repair

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-08-C-0112
Agency Tracking Number: B073-027-0479
Amount: $99,993.00
Phase: Phase I
Program: SBIR
Awards Year: 2008
Solicitation Year: 2007
Solicitation Topic Code: MDA07-027
Solicitation Number: 2007.3
Small Business Information
3400 Industrial Lane, Unit 7, Broomfield, CO, 80020
DUNS: 100363857
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Ofer Sneh
 (303) 466-2341
Business Contact
 Anat Sneh
Title: VP, Director of Operations
Phone: (303) 466-2341
Research Institution
The objective of this SBIR Phase I project is to demonstrate consistent and significant mitigation of tin whiskers growth and associated electronic circuit failure. Atomic Layer Deposition encapsulating films (ALD-Cap) are flexible ceramic films, with exceptional conformality, adherence and mechanical strength. Developed primarily as a low-cost environmental protection and corrosion barrier, ALD-Cap was successfully used to protect MMIC components used by the Navy, as well as other environmentally sensitive devices and components. Tin whiskers pose major safety, reliability and mission readiness threats to all makers and users of high performance and/or high reliability electronics. In the very near future, most military and other high-reliability electronics will likely require both environmental/corrosion protection and tin-whiskers containment/failure-risk-mitigation. ALD-Cap may provide a crucial solution for both problems. These ceramic coatings are more than 50 times tougher than Parylene, the toughest conformal coating attempted so far. At the same time ALD-Cap coatings are proven to be flexible and crack resistant. Tin whiskers growth will be conducted on test samples according to known procedures of inducing whiskers growth. ALD-Cap coating effectiveness in suppressing whiskers will be assessed. Further coating optimization and extended failure testing will be performed in Phase II.

* information listed above is at the time of submission.

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