Large Area Si Substrates for InP Based Electronics and Optical Device Manufacturing

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DASG60-02-P-0276
Agency Tracking Number: 02-0053T
Amount: $69,945.00
Phase: Phase I
Program: STTR
Awards Year: 2002
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
7620 Executive Drive, Eden Prairie, MN, 55344
DUNS: 876868647
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Peter Chow
 General Manager
 (952) 934-2100
Business Contact
 Jane Marks
Title: Project Manager
Phone: (952) 934-2100
Research Institution
 Northwestern University
 Susan G Ross
 Office of Research & Sponsored, Projects, 633 Clark Street
Evanston, IL, 60208
 (847) 491-3003
 Nonprofit college or university
InP-based devices have applications encompassing the entire communication technology including wireless and fiber-optic telecommunications. It is especially suitable for very high frequency (up to 200GHz) operation. Therefore they are increasingly acritical component in all military missions. Their manufacturing costs are high in large part due the high cost of InP substrates, and their much smaller size compared to that of Si. Device throughput per wafer is proportional to the square of waferdiameter, so to gain economy of scale larger wafer size is much more favorable. Furthermore, system performance may benefit from integration of the compound semiconductor devices directly on silicon. We propose an investigation of growing InP on siliconwafers which, when scaled up, could lead to 300 mm wafers for device fabrication. The robustness of the Si substrate will also lower processing costs. Such Si-based wafer platform could make the manufacturing significantly less expensive, and provideadvanced architecture for integration of opto- and micro-electronics to silicon-circuits. Larger substrates will produce significantly less expensive devices for optical and microwave communication, automotive electronics, medical equipment, and consumerelectronics.

* Information listed above is at the time of submission. *

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