Large Area Si Substrates for InP Based Electronics and Optical Device Manufacturing

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$69,945.00
Award Year:
2002
Program:
STTR
Phase:
Phase I
Contract:
DASG60-02-P-0276
Award Id:
55997
Agency Tracking Number:
02-0053T
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
7620 Executive Drive, Eden Prairie, MN, 55344
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
876868647
Principal Investigator:
Peter Chow
General Manager
(952) 934-2100
chow@svta.com
Business Contact:
Jane Marks
Project Manager
(952) 934-2100
marks@svta.com
Research Institution:
Northwestern University
Susan G Ross
Office of Research & Sponsored, Projects, 633 Clark Street
Evanston, IL, 60208
(847) 491-3003
Nonprofit college or university
Abstract
InP-based devices have applications encompassing the entire communication technology including wireless and fiber-optic telecommunications. It is especially suitable for very high frequency (up to 200GHz) operation. Therefore they are increasingly acritical component in all military missions. Their manufacturing costs are high in large part due the high cost of InP substrates, and their much smaller size compared to that of Si. Device throughput per wafer is proportional to the square of waferdiameter, so to gain economy of scale larger wafer size is much more favorable. Furthermore, system performance may benefit from integration of the compound semiconductor devices directly on silicon. We propose an investigation of growing InP on siliconwafers which, when scaled up, could lead to 300 mm wafers for device fabrication. The robustness of the Si substrate will also lower processing costs. Such Si-based wafer platform could make the manufacturing significantly less expensive, and provideadvanced architecture for integration of opto- and micro-electronics to silicon-circuits. Larger substrates will produce significantly less expensive devices for optical and microwave communication, automotive electronics, medical equipment, and consumerelectronics.

* information listed above is at the time of submission.

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