Pressure Sensor Electronics for High Temperature Drilling

Award Information
Agency:
Department of Energy
Branch
n/a
Amount:
$0.00
Award Year:
2003
Program:
SBIR
Phase:
Phase I
Contract:
DE-FG02-02ER83547
Award Id:
61569
Agency Tracking Number:
70291S02-II
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
7620 Executive Drive, Eden Prairie, MN, 55344
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Amir Dbiran
(952) 934-2100
dabiran@svta.com
Business Contact:
Jane Marks
(952) 934-2100
marks@svta.com
Research Institution:
n/a
Abstract
70291S02-II This project will demonstrate and produce a greatly improved monolithic differential amplifier and switch, based on AlGaN/GaN High Electron Mobility Transistors (HEMTs) and passive components, that will be capable of operating in the high-temperature oil drilling environment. The GaN-based amplifier will have reduced temperature sensitivity at temperatures up to 400¿C. The amplifier will utilize passive devices, such as resistors and capacitors, as well as active devices such as HEMT transistors with improved characteristics. Phase I improved the MBE growth of AlGaN/GaN high electron mobility transistors. High-temperature and high-pressure tests on GaN-based electronic components, including HEMTs and resistors, were performed. The feasibility of employing GaN-based electronics for the construction of high-temperature integrated circuits, such as onboard electronics used in geothermal well drilling and monitoring applications, was demonstrated. Phase II will demonstrate and produce a wide bandgap monolithic instrumentation amplifier and switching circuits that can be used in geothermal drilling and monitoring applications. Commercial Applications and Other Benefits as described by awardee: The high-temperature electronics should have application not only to geothermal and oil drilling but also to avionics, industrial process control, nuclear reactor monitoring, boiler combustion control systems, automotive underhood electronics, and space-based power systems.

* information listed above is at the time of submission.

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