High Altitude Airship Rechargeable MEMS Fuel Cell

Award Information
Agency:
Department of Defense
Amount:
$99,518.00
Program:
SBIR
Contract:
HQ0006-04-C-7056
Solitcitation Year:
2004
Solicitation Number:
2004.1
Branch:
Missile Defense Agency
Award Year:
2004
Phase:
Phase I
Agency Tracking Number:
B041-002-0884
Solicitation Topic Code:
MDA04-002
Small Business Information
SYSTEMS & PROCESSES ENGINEERING COR
101 West Sixth Street, Suite 200, Austin, TX, 78701
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
161214242
Principal Investigator
 Burt Fowler
 Principal Scientist
 (512) 479-7732
 fowler@spec.com
Business Contact
 Jean Lang
Title: Contracts Director
Phone: (512) 479-7732
Email: lang@spec.com
Research Institution
N/A
Abstract
SPEC offers lightweight, compact MEMS fuel cell for regenerative energy storage applications in HAA station keeping and operation above 65,000 feet MSL. More than one modular 10 KW unit is envisioned for the HAA. Modular unit provides 10KW at high efficiency, 60 KW peak in fuel cell mode, and absorbs 14 KW at high efficiency , 100 KW peak operation in electrolyzer mode. Innovative MEMS fuel cell backing plate approach gives stack sizes 10x smaller (210ƒY/cell) than traditional PEM fuel cells allowing proportional savings in weight per cell area. Lightweight per cell area supports optimal system weight savings (5 to 10x the fuel cell weight) through increased operational efficiency (area) trades for solar panel and fuel weight. Precision MEMS approach allows precise liquid/air interface control giving PEM hydration control in both fuel cell and electrolyzer modes for maximum efficiency and power output. Precise liquid/air interface and distribution eliminates auxiliary equipment and control systems. Integral nanotube catalyst support, grown on MEMS plates, gives minimal heat and electrical impedance, maximizing power output capability and efficiency. MEMS backing plates replace the flow field plate, gas diffusion layer and catalyst support with precision micro feature control and high producability of semiconductor processing.

* information listed above is at the time of submission.

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