High Speed Readout Focal Plane Array (HSRFPA)

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$809,111.00
Award Year:
2006
Program:
SBIR
Phase:
Phase II
Contract:
FA8650-06-C-1020
Agency Tracking Number:
F051-223-2694
Solicitation Year:
2005
Solicitation Topic Code:
AF05-223
Solicitation Number:
2005.1
Small Business Information
SYSTEMS & PROCESSES ENGINEERING CORPORAT
101 West Sixth Street Suite 200, Austin, TX, 78701
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
161214242
Principal Investigator:
Brad Sallee
Principal Research Scient
(512) 479-7732
sallee@spec.com
Business Contact:
W. McCone
Vice President of Contrac
(512) 479-7732
contracts@spec.com
Research Institution:
n/a
Abstract
Systems & Processes Engineering Corporation (SPEC) proposes an advanced hybridized detector Readout Integrated Circuit (ROIC) single chip solution that supports traditional sensor array and ROIC configurations of different detector wavelengths, but also an integrated detector and ROIC configuration enabling a single chip LADAR receiver solution. SPECs High Speed Readout Focal Plane Array (HSRFPA) is a high-speed capture, high-speed readout focal plane array processing chip that has internal processing block functions with configurations and timing sequences that are user selectable and controllable using external control and clocking inputs. The HSRFPA single chip detector and ROIC solution can be fabricated using a low cost standard CMOS process. The HSRFPA solution offers detection wavelengths and ROIC processing frequencies in a standard CMOS process that would normally require fabrication of diodes in an expensive Silicon/Germanium process. The development of coherent acoustic sensing LADAR¡¦s requires a ROIC which can support a 32x32 pixel array, and not only capture data at a 1 to 2 Giga Sample per second rate with a 256 deep sample depth, but also digitize and read the data off chip within 100ƒÝ seconds. This same ROIC can also support 3D imaging LADARS, either simultaneously or as stand-alone systems.

* information listed above is at the time of submission.

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