IR Smart Sensor ROIC

Award Information
Agency:
Department of Defense
Amount:
$99,860.00
Program:
SBIR
Contract:
HQ0006-07-C-7773
Solitcitation Year:
2006
Solicitation Number:
2006.3
Branch:
Missile Defense Agency
Award Year:
2007
Phase:
Phase I
Agency Tracking Number:
B063-011-0838
Solicitation Topic Code:
MDA06-011
Small Business Information
SYSTEMS & PROCESSES ENGINEERING CORP.(SP
101 West Sixth Street, Suite 200, Austin, TX, 78701
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
161214242
Principal Investigator
 Brad Sallee
 Principal Investigator
 (512) 479-7732
 sallee@spec.com
Business Contact
 W. McCone
Title: Vice President of Contracts
Phone: (512) 479-7732
Email: contracts@spec.com
Research Institution
N/A
Abstract
Systems & Processes Engineering Corporation (SPEC) proposes an advanced, single-chip, hybridized detector Readout Integrated Circuit (ROIC) and an integrated detector enabling a single-chip large array ROIC receiver solution. The smart pixel circuitry supports on chip multi-frame, pixel by pixel comparison to enable reporting only when scene content changes are greater than some user specified threshold. This technique reduces I/O bandwidth by eliminating the requirement to read out the entire array. Upon exceeding threshold, a precision time stamp for that particular detector will be added to the output file to facilitate high precision tracking algorithms. In addition, an optimized transimpedance amplifier will minimize the Noise Effective Power (NEP) of the sensor assembly. SPECs IR Smart Sensor ROIC (IRSSR) leverages from existing LADAR ROIC circuit modules were each detector is coupled to a trans-impedance amplifier (TIA) directly under each detector pixel. SPEC has previously developed LADAR smart pixel ROIC’s with the TIA, multiple sample and hold data storage, and independent sample timing circuits directly below each detector pixel in the array to enable the multiple independent signal returns per pixel processing required in a LADAR system application. These modules, with an optimized TIA, will be built into the IRSSR pixel logic.

* information listed above is at the time of submission.

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