Low Shock Stage Separation System For The KEI

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$99,942.00
Award Year:
2006
Program:
SBIR
Phase:
Phase I
Contract:
W9113M-06-C-0060
Agency Tracking Number:
053-0221
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
SYSTIMA TECHNOLOGIES, INC.
1832 180th St. SE, Bothell, WA, 98012
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
086581902
Principal Investigator:
Aaron Freiheit
Senior Development Engineer
(425) 487-4020
Aaron.Freiheit@systima.com
Business Contact:
Tom Prenzlow
Director, Operations
(425) 487-4020
Tom.Prenzlow@systima.com
Research Institution:
n/a
Abstract
Systima Technologies, Inc. (Systima), in conjunction with San Diego Composites, LLC (SDC), is proposing to develop a comprehensive low shock stage separation system for the KEI. Systima is proposing to evaluate, design and develop low shock stage separation technology, while SDC will evaluate, design and develop lightweight and rigid composite interstage structures. The Systima and SDC team have the capabilities and experience to successfully develop a comprehensive and tightly integrated low shock separation system that will be ready for insertion into the KEI program. Typical (e.g. explosives-based) stage separation systems generate tremendously high shock loads. This shock energy is readily transmitted through the structure of the missile interceptor and into the kill vehicle, where sensitive components can be damaged due to the high shock loads. The development of low shock separation system technologies will permit the incorporation of electronic and optical components with greater sensitivity than is currently possible with existing stage separation systems. In addition, due to its mission requirements, the KEI program is looking to reduce the weight of KEI components and systems. Systima and SDC propose to incorporate composite materials into the design of the interstage structure to lower its weight while maintaining high stiffness.

* information listed above is at the time of submission.

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