Secure Circuit Board Materials and Processes

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$749,137.00
Award Year:
2003
Program:
SBIR
Phase:
Phase II
Contract:
F33615-03-C-5007
Award Id:
57579
Agency Tracking Number:
021ML-1985
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
4027 Colonel Glenn Highway, Suite 210, Dayton, OH, 45431
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
023956415
Principal Investigator:
V.Nagarajan
VP for Research & Program
(937) 429-9008
nagu@systranfederal.com
Business Contact:
KennethBaker
President & COO
(937) 429-9008
kbaker@systranfederal.com
Research Institute:
n/a
Abstract
Systran Federal Corporation (SFC), the sister-company of Systran Corp., which is a Products Development and Marketing Company specializing in high-performance electronic and networking products, had proposed novel approaches to developing tamper resistantcircuit boards. The Phase I work demonstrated the feasibility of this innovation.In Phase II, a wavelet compression/decompression circuit board will be designed. This circuit board, in addition to the chips and components required for image compression and decompression, will also contain chips, sensors, multi-layer coatings, etc.,that will make the board tamper-proof. We have chosen wavelet board for Phase II development since the Air Force is very much interested in a tamper-proof image compression/decompression circuit board that will be included in UAVs/UCAVs andprecision-guided munitions. There is considerable interest in the development of such a circuit board at the Information Directorate (IF), Sensor Directorate (SN) and the Munitions Directorate (MN) at AFRL.SFC has strong expertise in building complex circuit boards. SFC has assembled three subcontractors, UDRI (University of Dayton Research Institute), ICS (Integrated Coating Solutions) Inc., and MST (MesoScribe Technologies) Inc., who have strong expertisefor developing and applying multilayer coatings (sol-gel, epoxy, low-temperature thermal spray, etc.).

* information listed above is at the time of submission.

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