Flexible Reconfigurable Analog Matrix

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$99,953.00
Award Year:
2004
Program:
SBIR
Phase:
Phase I
Contract:
FA9453-04-M-0258
Award Id:
69648
Agency Tracking Number:
B041-048-0601
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
4027 Colonel Glenn Highway, Suite 210, Dayton, OH, 45431
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
023956415
Principal Investigator:
Todd Grimes
Principal Investigator
(937) 429-9008
tgrimes@systranfederal.com
Business Contact:
Kenneth Baker
President & Chief Operati
(937) 429-9008
kbaker@systranfederal.com
Research Institution:
n/a
Abstract
Today's anti-missile systems are increasingly becoming an important resource for the defense of the nation. The success of our anti-missile systems depends on establishing superior technology to maintain an advantage. Even with the latest advancements in missile technology, size, weight, and packaging constraints remain an inherent limitation in these modern weapon systems. The MDA is focusing on the dramatic reduction of the size and weight of analog seeker electronics and to minimize the time required to integrate new sensor technologies into seeker applications by utilizing reconfigurable analog electronics. The primary sensors of interest include focal plane arrays, RADAR, LADAR, and cryogenic coolers. Systran Federal Corp. believes that a viable solution lies in the development of a flexible analog interfacing architecture that utilizes reconfigurable analog components. This new architecture would exploit recent advancements in reconfigurable analog components, including Field Programmable Analog Arrays, reconfigurable analog components (i.e., op amps, comparators, etc.), and microcontrollers with integrated analog-to-digital converters and digital-to-analog converters. Combinations of these devices, along with Field Programmable Gate Arrays, would provide a flexible analog architecture that promotes the reduction in the size, weight, packaging, and in the amount of time required to upgrade analog sensors for missile systems.

* information listed above is at the time of submission.

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