Flexible Reconfigurable Analog Matrix

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: FA9453-04-M-0258
Agency Tracking Number: B041-048-0601
Amount: $99,953.00
Phase: Phase I
Program: SBIR
Awards Year: 2004
Solitcitation Year: 2004
Solitcitation Topic Code: MDA04-048
Solitcitation Number: 2004.1
Small Business Information
4027 Colonel Glenn Highway, Suite 210, Dayton, OH, 45431
Duns: 023956415
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Todd Grimes
 Principal Investigator
 (937) 429-9008
Business Contact
 Kenneth Baker
Title: President & Chief Operati
Phone: (937) 429-9008
Email: kbaker@systranfederal.com
Research Institution
Today's anti-missile systems are increasingly becoming an important resource for the defense of the nation. The success of our anti-missile systems depends on establishing superior technology to maintain an advantage. Even with the latest advancements in missile technology, size, weight, and packaging constraints remain an inherent limitation in these modern weapon systems. The MDA is focusing on the dramatic reduction of the size and weight of analog seeker electronics and to minimize the time required to integrate new sensor technologies into seeker applications by utilizing reconfigurable analog electronics. The primary sensors of interest include focal plane arrays, RADAR, LADAR, and cryogenic coolers. Systran Federal Corp. believes that a viable solution lies in the development of a flexible analog interfacing architecture that utilizes reconfigurable analog components. This new architecture would exploit recent advancements in reconfigurable analog components, including Field Programmable Analog Arrays, reconfigurable analog components (i.e., op amps, comparators, etc.), and microcontrollers with integrated analog-to-digital converters and digital-to-analog converters. Combinations of these devices, along with Field Programmable Gate Arrays, would provide a flexible analog architecture that promotes the reduction in the size, weight, packaging, and in the amount of time required to upgrade analog sensors for missile systems.

* information listed above is at the time of submission.

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