STATIC-2

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-08-C-0089
Agency Tracking Number: A062-030-1909
Amount: $729,900.00
Phase: Phase II
Program: SBIR
Awards Year: 2008
Solitcitation Year: 2006
Solitcitation Topic Code: A06-030
Solitcitation Number: 2006.2
Small Business Information
SYSTRAN FEDERAL CORP.
4027 Colonel Glenn Highway, Suite 210, Dayton, OH, 45431
Duns: 023956415
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Robert Gillen
 Principal Investigator
 (937) 429-9008
 rgillen@systranfederal.com
Business Contact
 William Thompson
Title: Contracts Manager
Phone: (781) 890-1338
Email: bthompson@infoscitex.com
Research Institution
N/A
Abstract
Systran Federal Corp. (SFC), along with our university research partners, proposes to continue development of active anti-tamper (AT) sensors for the purpose of protecting sensitive integrated circuits (ICs) and data from adversaries and reverse engineers. Several IC AT techniques currently exist, but are inadequate because of high cost, lack of effectiveness, difficulty in use, unreliability, and inability to work together in a single, multi-mode sensor. SFC has addressed these problems in Phase I by both refining existing techniques and developing new techniques and schemes for putting these into practice. For example, our previously developed active AT circuit board coatings have been redesigned with IC protection as the goal. We will rely on our previous AT experience for near-term solutions, while exploring advanced long-term AT techniques using technologies such as MEMS, nanotechnology, and materials that can detect several types of intrusion. SFC has assembled a distinguished team to address this proposal. In conjunction with our university research partner, we are proposing a novel and innovative approach to meeting the demanding requirements listed in the solicitation. At the conclusion of Phase II, we plan to have a pre-production version of our product ready for immediate deployment in selected applications.

* information listed above is at the time of submission.

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