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High Temperature Electrical Insulation Materials for Space Applications

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNC05CA59C
Agency Tracking Number: 041678
Amount: $70,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: E2.07
Solicitation Number: N/A
Timeline
Solicitation Year: 2004
Award Year: 2005
Award Start Date (Proposal Award Date): 2005-01-21
Award End Date (Contract End Date): 2005-07-25
Small Business Information
P.O. Box 2150
Ann Arbor, MI 48106-2150
United States
DUNS: 804705101
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: Yes
Principal Investigator
 Junqing Ma
 Principal Investigator
 (734) 213-1637
 jma@tjtechnologies.com
Business Contact
 Maria Thompson
Title: Business Official
Phone: (734) 213-1637
Email: mthompson@tjtechnologies.com
Research Institution
N/A
Abstract

NASA's future space science missions cannot be realized without the state of the art high temperature insulation materials of which higher working temperature, high reliability, and low cost are highly desired. T/J Technologies proposes to develop a high temperature, durable, readily processable electrical insulation materials. The key element of our approach is the development and demonstration, in a breadboard configuration, the feasibility of a new high temperature polymeric composite material based on organic-inorganic nanocomposites with tailored structure and composition that will dramatically increase the Glass Transition Temperature and working temperature of the host polymer, polyimides. Future work of this proposed research, during phase II, will be mainly focused on developing all the associated technologies. The development of high working temperature, durable, radiation resistant electrical insulation materials is important for on-board propulsion and power systems for manned and unmanned deep space missions within NASA as well as electrical and microelectronic industries for applications such as capacitors, electric motors, circuit-printing films, semiconductor coating, etc.

* Information listed above is at the time of submission. *

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