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Ultra-sensitive shear stress/pressure sensor and smart piezoelectric actuator for flapping-wing dragonfly model

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9550-09-C-0031
Agency Tracking Number: F08A-008-0205
Amount: $99,998.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: AF08-T008
Solicitation Number: 2008.A
Timeline
Solicitation Year: 2008
Award Year: 2009
Award Start Date (Proposal Award Date): 2008-08-01
Award End Date (Contract End Date): 2009-05-01
Small Business Information
1430 Oak Court Ste. 301
Beavercreek, OH 45430
United States
DUNS: 794958835
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: Yes
Principal Investigator
 Chung-Jen Tam
 Chief Operating Officer
 (937) 255-4146
 Chung-Jen.Tam@wpafb.af.mil
Business Contact
 Tai-Jen Chen
Title: President & CFO
Phone: (937) 431-1007
Email: chentj@taitech.com
Research Institution
 WRIGHT STATE UNIV.
 Haibo Dong
 
209 Russ Eng. Center, MME 3640 Colonel Glenn Highway
Dayton, OH 45435
United States

 (937) 775-5040
 Nonprofit College or University
Abstract

The innovation of the proposal is threefold: 1) the application of AFM technology on MAVs to pursue ultrahigh-sensitive pressure sensor, 2) 3-dimensional high-efficiency flight control model of flapping-wing dragonfly, 3) piezoelectric materials based smart actuator to control the dragonfly flight. In particular, the sensing of environment by snulps and the successive reaction by smpa are inspected and supervised through the state-of-art 3-dimensional aerial dynamic modeling. This provides a close-to-real platform to study the aerodynamics with small Reynolds number, and to exam the flight condition visually to eventually realize the control of the agile flight. The coherent study on coordination of sensing, date-processing, and actuating, we believe, is the core knowledge and technology for future MAVs. In addition, a high-fidelity shear stress sensor will be developed to measure the flow features on the MAV and also to validate the numerical predictions in the Phase II efforts. The unique technology proposed here is compatible with the standard semiconductor industry, which guarantees a straightforward technology transfer from university to industry.

* Information listed above is at the time of submission. *

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