Rugged Low Heat Leak Cryogenic Seals and Electrical Quick Disconnects

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$749,439.00
Award Year:
2008
Program:
SBIR
Phase:
Phase II
Contract:
N00014-08-C-0163
Award Id:
77221
Agency Tracking Number:
N062-158-0241
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
9112 Farrell Park Lane, Knoxville, TN, 37922
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
091580501
Principal Investigator:
W.Marshall
Principal Engineer
(865) 805-7261
wsmarshall@tai-yang.com
Business Contact:
ChrisRey
President
(865) 250-0237
cmrey@tai-yang.com
Research Institute:
n/a
Abstract
An advanced degaussing system utilizing high temperature superconducting (HTS) cables is being developed by the the Navy for application to new ship systems. The proposed system reduces the system weight and installed cost over degaussing system designs that use copper cables. HTS cables operate in a cryogenic environment, and are housed in a vacuum-jacketed conduit. The terminations for HTS cables are complex, requiring provision for vacuum, cryogens and superconductors. The present lab-scale HTS cable terminations are bulky, labor-intensive to fabricate, and ill suited for shipboard installation. The Tai-Yang Research Company (TYRC), in an ONR-sponsored Phase I SBIR effort, designed a quick disconnect terminal fitting for a high temperature superconducting cable that provides simultaneous electrical and cryogenic connection in a compact, rugged and simple package. In the proposed Phase II Base project and Options I-IV, TYRC proposes to advance the degaussing cable technology from TRL 3 to TRL 6. The proposed effort includes several prototype connector design/build/test iterations, a factory connector test facility, a full-length HTS degaussing cable assembly, and a facility for testing the cable onboard a ship platform. TYRC will develop a manufacturing plan and supplier relationships in order to successfully transition the program to Phase III.

* information listed above is at the time of submission.

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