Polymer and/or Metal Matrix Composite Materials for Thermal Management of Electronic Devices
Small Business Information
Technical Research Assoc.,
410 Chipeta Way, Suite 222, Salt Lake City, UT, 84108
Mr. Joseph K. Weeks
Abstract1Heat sinks in the Navy Standard Electronic Module could be improved by increasing the thermal conductivity of the heat sink, decreasing its density and providing a better match between the coefficient of thermal expansion of the heat sink and the electronic circuit boards. Based upon a proprietary fiber coating technology, TRA proposes to investigate the production of copper/graphite composite heat sinks made by liquid metal infiltration. Feasibility of producing a Format D heat sink which incorporates offsets and variations in material thickness will be demonstrated by fabricating a prototype heat sink. The physical and thermal properties of the heat sink will be measured and compared with predicted values. Improved thermal conductivity will be obtained by incorporating highmodulus, high conductivity graphite fibers into the composite.
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