Evacuated Microsphere Insulation Panels

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: N/A
Agency Tracking Number: NASA676
Amount: $70,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2001
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
5445 Conestoga Court, #2A, Boulder, CO, 80301
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Robert Mohling
 President/General Manager
 (303) 443-2262
Business Contact
 Fred Fusilier
Title: Business Manager
Phone: (303) 443-2262
Email: ffusilier@techapps.com
Research Institution
Technology Applications, Inc. is proposing to develop a unique evacuated microsphere insulation (MSI) panel that is over twice as effective as polyurethane foam insulation in a one-atmosphere environment and approaches multilayer insulation performance in a vacuum environment. The MSI is rugged, easily applied to cryogenic transfer lines, and not subject to degradation from environmental exposure or thermal cycling. This insulation system will enable the effective distribution and transfer of cryogens over long distances; it is a promising candidate for reusable launch vehicles, space applications, and low-pressure atmospheric applications, such as cryogenic storage and transfer for Mars missions.The MSI consists of microsphere filled panels that are vacuum tight and can be configured to fit any symmetrical shape. The microspheres provide structural support for the vacuum shell while reducing radiation heat transfer by reflection and scattering. Gaseous conduction is greatly reduced by evacuating to <10E-2 torr, and solid conduction is minimized because the glass microspheres make only point contact with each other. The Phase I study will demonstrate the feasibility of the MSI through design, analysis, and the fabrication and testing of candidate panels. During the Phase II development program, representative MSIs will be fabricated and rigorously tested under operational conditions

* Information listed above is at the time of submission. *

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