Measurement of Residual Stresses in Difficult Locations

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$748,054.00
Award Year:
2002
Program:
SBIR
Phase:
Phase II
Contract:
F09650-02-C-0517
Award Id:
52585
Agency Tracking Number:
011XP-1895
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
10737 Lexington Drive, Knoxville, TN, 37932
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
030664510
Principal Investigator:
BethMatlock
Senior Materials Engineer
(865) 966-5856
bmatlock@tec-usa.com
Business Contact:
CarolBailey
Vice President
(865) 966-5856
cbailey@tec-usa.com
Research Institute:
n/a
Abstract
The Air Force identified measuring stresses in hard-to-access locations as a major concern. Detrimental stresses in these locations lead to expensive loss of use, inspection and repair costs, and potential loss of aircraft and personnel.X-Ray diffraction--a proven technique for measuring stresses--has been taken from the laboratory to field use on large structures. However, current systems do not permit measurements in hard-to-access locations.TEC has successfully reduced the measurement head to fit inside a 6-inch diameter hole and obtain the correct stresses in aluminum. TEC proposes to reduce the measurement head to approximately 4 inches and measure stresses in aluminum, ferritic/martensiticsteels, and titanium alloys. Elements are in place for successfully measuring austenitic steels and nickel, provided a miniature manganese x-ray tube is obtainable.The ultimate goal is to produce a hand-carried, rugged, low-power consumption instrument that can correctly measure stresses in difficult-to-access locations. Emphasis will be on power requirements, personnel safety, measurement speed, data availability,ease of use and data interpretation.The proposed instrument should result in significant maintenance savings and has commercial applications to virtually all industries relying on common engineering alloys for safety-related functions.

* information listed above is at the time of submission.

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