HOLOGRAPHIC INTERFEROMETRY FOR THE ANALYSIS OF THE ELECTRO-ACOUSTIC EFFECT

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$60,113.00
Award Year:
1992
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Award Id:
18354
Agency Tracking Number:
18354
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Tetra Corp. (Currently Tetra Corp)
3701 Hawkins Street, N.e., Albuquerque, NM, 87109
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Juan Elizondo
(505) 345-8623
Business Contact:
() -
Research Institution:
n/a
Abstract
THIS PROPOSAL DESCRIBES THE USE OF HOLOGRAPHIC INTERFEROMETRY TO STUDY BOTH THE MECHANICAL AND ELECTRICAL STRESS CHARACTERISTICS OF THIN POLYMER FILMS, SPECIFICALLY THOSE EXHIBITING ELECTROACOUSTICAL BEHAVIOR SUCH AS POLYUREAS AND POLYURETHANES. WE PROPOSE TO CORRELATE THE HOLOGRAPHIC FRINGE PATTERN, CREATED BY THE MECHANICAL STRESS INDUCED BY THE APPLIED ELECTRIC FIELD, TO THE CHARGE DISTRIBUTION INDUCED IN THE POLYMER BY THE ELECTRIC FIELD. THE CORRELATION IS INITIATED BY THE KNOWLEDGE OF THE ELECTRIC FIELD DISTRIBUTION IN THE SAMPLE AND ITS SURROUNDING. THE INDUCED MECHANICAL STRESS IS THEN MAPPED IN RELATIONSHIP WITH SUCH ELECTRIC FIELD DISTRIBUTION. TWO AND THREE DIMENSIONAL IMAGING OF STRESS DISTRIBUTIONS ARE CONSIDERED IN THE PROPOSED WORK. THE MACROSCOPIC CORRELATION OF THESE TWO PARAMETERS YIELDS THE UNDERSTANDING OF THE SURFACE TO BULK INTERFACING AND INTERACTION. THE NEXT STEP IS TO UNDERSTAND THE COUPLING, AT THE MOLECULAR DIPOLE LEVEL, TO THE ELECTRICAL STRESS AND THE INDUCED MECHANICAL DEFORMATION. ANTICIPATED BENEFITS: WIDE APPLICATIONS FOR LINE INSPECTION OF POLYMERS PRODUCING AND COATED HIGH VOLTAGE CABLE TRANSMISSION LINES FOR POWER DISTRIBUTION. DEVELOPMENT OF "FLAT" SPEAKERS FOR THE NEW GENERATION OF FLAT SCREEN TELEVISION MONITORS, IS POSSIBLE WITH THIS TECHNOLOGY, WITH GREAT IMPACT ON CONSUMER ELECTRONICS.

* information listed above is at the time of submission.

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