Application of Bonded Multilayer Technology to Relaxor-Based Single Crystals for Imaging Transducer Applications

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: DAAH0101CR141
Agency Tracking Number: 01SB1-0056
Amount: $97,303.00
Phase: Phase I
Program: SBIR
Awards Year: 2001
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
357 Inverness Dr. South, Suite A, Englewood, CO, 80112
DUNS: 155242126
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Michael Zipparo
 R&D Engineer
 (303) 754-2309
Business Contact
 Dennis Dietz
Title: Executive Vice President
Phone: (303) 754-2306
Research Institution
Bonded multilayer crystal technology will be developed for ultrasound transducer applications. Single crystal materials have demonstrated enormously high coupling constants, over 94% in some modes. Bonded multilayers have already been demonstrated tomaintain the coupling inherent in the base material, and to result in an effective increase in the dielectric constant of the structure equal to the square of the number of layers. The application of multilayers to single crystals will result in whatshould be considered the ultimate trasnducer material. Multilayer crystal composites will have a low acoustic impedance, and a very high effective dielectric constant and coupling coefficient. Modeling shows that the bandwidth that will be obtainablewith these devices will exceed 120%, even for arrays which normally are severely limited because of the much lower dielectric associated with traditional materials and configurations.The benefits of applying these materials to ultrasonic arrays will bemuch higher bandwidth and sensitivity of devices, particularly those which are usually limited by element area, such as phased arrays and 1.5-D and 2-D arrays. Even single crystals are limited in their performance without the capacitance increaseassociated with a multtilayer.

* Information listed above is at the time of submission. *

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