Assessing the Impact of Lead-free Solders on the Long-term Reliability of Weapon System Electronics.
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TEXAS RESEARCH INSTITUTE AUSTIN, INC.
9063 Bee Caves Road, Austin, TX, 78733
AbstractLead based solders have been used for decades to make conductive and structural connections in electronic assemblies. Whole manufacturing technologies are based on the melt, flow and wetting characteristics of these materials and establishing new solderplatforms requires substantial and pervasive changes in the industry. As industry moves away from the use of lead in electronic assemblies, the development of qualification standards and reliability models for lead free solders and conductive adhesives isneeded to ensure continued performance reliability. In the proposed work, TRI/Austin will develop and validate life accelerating procedures and reliability models that can be used as a
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