Assessing the Impact of Lead-free Solders on the Long-term Reliability of Weapon System Electronics.

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$728,037.00
Award Year:
2003
Program:
SBIR
Phase:
Phase II
Contract:
W31P4Q-04-C-R042
Award Id:
58131
Agency Tracking Number:
A012-0579
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
9063 Bee Caves Road, Austin, TX, 78733
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
625120902
Principal Investigator:
George Zeller
Co-Principal Investigator
(512) 263-2101
ghansen@tri-austin.com
Business Contact:
Monte Fellingham
Contracts Administrator
(512) 263-2101
mfellingham@tri-austin.com
Research Institute:
n/a
Abstract
Lead based solders have been used for decades to make conductive and structural connections in electronic assemblies. Whole manufacturing technologies are based on the melt, flow and wetting characteristics of these materials and establishing new solderplatforms requires substantial and pervasive changes in the industry. As industry moves away from the use of lead in electronic assemblies, the development of qualification standards and reliability models for lead free solders and conductive adhesives isneeded to ensure continued performance reliability. In the proposed work, TRI/Austin will develop and validate life accelerating procedures and reliability models that can be used as a

* information listed above is at the time of submission.

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