Assessing the Impact of Lead-free Solders on the Long-term Reliability of Weapon System Electronics.

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$70,000.00
Award Year:
2002
Program:
SBIR
Phase:
Phase I
Contract:
DAAH01-02-C-R109
Award Id:
58131
Agency Tracking Number:
A012-0579
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
9063 Bee Caves Road, Austin, TX, 78733
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
625120902
Principal Investigator:
GeorgeHansen
Principal Investigator
(512) 263-2101
rrushing@tri-austin.com
Business Contact:
MonteFellingham
Contracts Administrator
(512) 263-2101
mfellingham@tri-austin.com
Research Institute:
n/a
Abstract
"Lead based solders have been used for decades to make conductive and structural connections in electronic assemblies. Whole manufacturing technologies are based on the melt, flow and wetting characteristics of these materials and establishing new solderplatforms requires substantial and pervasive changes in the industry. As industry moves away from the use of lead in electronic assemblies, the development of qualification standards for lead free solders and conductive adhesives is needed to ensurecontinued performance reliability. In the proposed work, TRI/Austin will develop procedures that can be used as a "standard of evaluation" for lead free solders, making it possible to compare them with each other and with well established lead/tinsolders. During Phase I, leading lead free solder alloys and conductive adhesives suitable for military applications will be cataloged. Standardized models to predict thermal-mechanical failure will be developed, given a formulation and a specifiedgeometry. A standardized stress test will be designed to validate the above model and enhance failure prediction. TRI's expertise in accelerated life testing will provide the basis for evaluating lead free solders using thermal models and in thesimulation of actual exposures to various "real world" environmental conditions. The proposed technology will be enhance the reliability of future missile and other weapons systems, and is applicable to Nationa

* information listed above is at the time of submission.

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