Ultra-Dense Three-Dimensional Electronics for Space

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$100,000.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
FA9453-08-M-0020
Agency Tracking Number:
F073-099-1695
Solicitation Year:
2007
Solicitation Topic Code:
AF073-099
Solicitation Number:
2007.3
Small Business Information
TEZZARON SEMICONDUCTOR CORP.
1415 Bond St., #111, Naperville, IL, 60563
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
844118195
Principal Investigator:
Robert Patti
CTO
(630) 505-0404
rpatti@tezzaron.com
Business Contact:
Sal Burd
CFO
(630) 505-0404
sburd@tezzaron.com
Research Institution:
n/a
Abstract
Tezzaron proposes the development of a 3D integrated memory on processor or host device. The proposed device is made from a very high-performance 3D integrated 512Mb DRAM memory device and a structured array with single layer customization. Both devices in the ultimate 3D integration have a high degree of radiation hardness and also have low power and an ultra-compact form factor.

* information listed above is at the time of submission.

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