Ultra-Dense Three-Dimensional Electronics for Space
Small Business Information
1415 Bond St., #111, Naperville, IL, 60563
AbstractTezzaron proposes the development of a 3D integrated memory on processor or host device. The proposed device is made from a very high-performance 3D integrated 512Mb DRAM memory device and a structured array with single layer customization. Both devices in the ultimate 3D integration have a high degree of radiation hardness and also have low power and an ultra-compact form factor.
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