Ultra-Dense Three-Dimensional Electronics for Space

Award Information
Agency:
Department of Defense
Amount:
$100,000.00
Program:
SBIR
Contract:
FA9453-08-M-0020
Solitcitation Year:
2007
Solicitation Number:
2007.3
Branch:
Air Force
Award Year:
2008
Phase:
Phase I
Agency Tracking Number:
F073-099-1695
Solicitation Topic Code:
AF073-099
Small Business Information
TEZZARON SEMICONDUCTOR CORP.
1415 Bond St., #111, Naperville, IL, 60563
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
844118195
Principal Investigator
 Robert Patti
 CTO
 (630) 505-0404
 rpatti@tezzaron.com
Business Contact
 Sal Burd
Title: CFO
Phone: (630) 505-0404
Email: sburd@tezzaron.com
Research Institution
N/A
Abstract
Tezzaron proposes the development of a 3D integrated memory on processor or host device. The proposed device is made from a very high-performance 3D integrated 512Mb DRAM memory device and a structured array with single layer customization. Both devices in the ultimate 3D integration have a high degree of radiation hardness and also have low power and an ultra-compact form factor.

* information listed above is at the time of submission.

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