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Ultra-Dense Three-Dimensional Electronics for Space

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9453-08-M-0020
Agency Tracking Number: F073-099-1695
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: AF073-099
Solicitation Number: 2007.3
Timeline
Solicitation Year: 2007
Award Year: 2008
Award Start Date (Proposal Award Date): 2008-01-15
Award End Date (Contract End Date): 2009-01-15
Small Business Information
1415 Bond St. #111
Naperville, IL 60563
United States
DUNS: 844118195
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Robert Patti
 CTO
 (630) 505-0404
 rpatti@tezzaron.com
Business Contact
 Sal Burd
Title: CFO
Phone: (630) 505-0404
Email: sburd@tezzaron.com
Research Institution
N/A
Abstract

Tezzaron proposes the development of a 3D integrated memory on processor or host device. The proposed device is made from a very high-performance 3D integrated 512Mb DRAM memory device and a structured array with single layer customization. Both devices in the ultimate 3D integration have a high degree of radiation hardness and also have low power and an ultra-compact form factor.

* Information listed above is at the time of submission. *

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