Design and Fabrication Techniques for 3-Dimensional Integrated Circuits

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: W31P4Q-10-C-0012
Agency Tracking Number: 09SB1-0146
Amount: $98,955.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: 2009
Solicitation Topic Code: SB091-008
Solicitation Number: 2009.1
Small Business Information
1415 Bond St., #111, Naperville, IL, 60563
DUNS: 844118195
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Robert Patti
 CTO
 (630) 505-0404
 rpatti@tezzaron.com
Business Contact
 Robert Patti
Title: CTO
Phone: (630) 505-0404
Email: rpatti@tezzaron.com
Research Institution
N/A
Abstract
Tezzaron proposes to use and extend its 3D wafer stacking technology to produce a 8Gb DRAM. The device will be made from 8 layers of memory and a single logic control layer, providing density far beyond the capability of current commercial technology. A device of this density can offer significant improvements in system power, size, weight and performance. The major unknown in creating a device like this, are the issues that may arise when 3D integration is practiced beyond Tezzaron current devices of 3 or 4 tiers. In Phase I "dummy" wafers will be stacked to determine the feasibility of the planned 9 layer device to be fabricated as part of Phase II.

* Information listed above is at the time of submission. *

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