Ultra-Dense Three-Dimensional Electronics for Space

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$679,805.00
Award Year:
2009
Program:
SBIR
Phase:
Phase II
Contract:
FA9453-09-C-0019
Agency Tracking Number:
F073-099-1695
Solicitation Year:
2007
Solicitation Topic Code:
AF073-099
Solicitation Number:
2007.3
Small Business Information
Tezzaron Semiconductor Corp.
1415 Bond St., #111, Naperville, IL, 60563
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Robert Patti
CTO
(630) 505-0404
rpatti@tezzaron.com
Business Contact:
Robert Patti
CTO
(630) 505-0404
rpatti@tezzaron.com
Research Institution:
n/a
Abstract
Two radiation hardened 3D integrated circuit memory devices will be fabricated under this effort. The 3D devices are created by the wafer level 3D bonding of separate silicon substrates. Within each of the ~200 die in the resultant wafer stack, there some 5 million vertical interconnects. The very high level of 3D interconnect allows unprecedented vertical circuit optimization. In this case the two proposed devices will be fabricated with the same masks and both will share the same memory cell layers that are also used for Tezzaron’s standard commercial memories. This allows not only a cost reduction but also eases commercial production by keeping the non-ASIC portion of the components in common. The core effort in this program is developing a new hardened by design logic layer (wafer) that will improve the circuit reliability for space and military applications. The 3D integration by its nature will also give improve density, power and performance. Without 3D, the intended hardening improvements would be entirely impossible. BENEFIT: Higher density memory with significantly improved power and reliability with high radiation tolerance. Also due to the sharing of volume commercial pieces, a more reasonable cost structure should be achievable.

* information listed above is at the time of submission.

Agency Micro-sites

US Flag An Official Website of the United States Government