Advanced Electronic Cooling Technologies

Award Information
Agency:
Department of Defense
Amount:
$99,678.00
Program:
SBIR
Contract:
FA8650-09-M-5036
Solitcitation Year:
2008
Solicitation Number:
2008.3
Branch:
Air Force
Award Year:
2009
Phase:
Phase I
Agency Tracking Number:
F083-222-2047
Solicitation Topic Code:
AF083-222
Small Business Information
Thermacore, Inc.
780 Eden Road, Lancaster, PA, 17601
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
055625685
Principal Investigator
 John Thayer
 Senior Research Engineer
 (717) 519-3136
 j.g.thayer@thermacore.com
Business Contact
 Nelson Gernert
Title: Vice President of Engineering
Phone: (717) 519-5817
Email: n.j.gernert@thermacore.com
Research Institution
N/A
Abstract
A new material, diamond-copper composite, is proposed for the evaporator of a copper-water heat pipe. The composite offers two benefits; very high thermal conductivity and CTE in the same range as semiconductor material. These properties enable heat pipes that can be directly attached to the highest power dies. The high conductivity layer spreads the heat, lowering the flux from 1000 W/cm2 to 100 W/cm2, a level which can be handled by the heat pipe wick. The CTE, tailorable over the range of common semiconductors, reduces thermally induced stress at the die interface. The conventional copper condenser of such a heat pipe could extend through the package, thermally linking the die to a cold rail or other heat sink. This design would eliminate several layers and interfaces, lowering the overall thermal resistance by 20-50%. BENEFIT: This design would enable lower operating temperatures for high power electronics components. This technology is equally applicable to military and commercial products. Initial revenue potential would be on the order of $0.5-2m per year, with future potential $10-20m per year in 5 years.

* information listed above is at the time of submission.

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