Low Cost Ka-Band Transmit/Recieve (T/R) module
Small Business Information
Tlc Precision Wafer (Currently TLC Precision Wafer Technology, Inc.)
661 5th Avenue N. #160, Minneapolis, MN, 55411
AbstractThe technical problem to be addressed is that of designing a transmit/recieve module based on a basic GaAs MMIC chip set. Emphasis will be placed on simplicity toward the goal of a low-cost product. To reduce cost, two approaches will be considered. One is to simplify the RF circuitry and packaging as much as possible while maintaining performance requirements. Two is to apply batch processing techniques to the packaging as well as the circuitry. Experimental test data from existing Ka-band MMICs, as well as computer simulations, will be utilized in performing the trade-off analysis. A radiating element will be designed for fabrication directly with the module. This is imperative in order to avoid the need for seperate connections and to keep the cost of the module down. For application to an active phased array antenna, two basic configurations for arranging the radiating elements in the array. The tile configuration is suitable for patch radiators, while the brick configuration is suitable for end-fire dipole, slot line or finline antennas. BENEFITS: The market for mm-wave phased array antennas for commercial applications is potentially very large (e.g., as radar sensors for vehicular application) provided that T/R module costs can be reduced significantly from the present levels.
* information listed above is at the time of submission.