Bandgap Engineered Rad-Hard Multi-Function Digital MMW/Photonic Circuits

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$750,000.00
Award Year:
2004
Program:
SBIR
Phase:
Phase II
Contract:
DTRA01-02-C-0092
Agency Tracking Number:
00-1112
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
TLC PRECISION WAFER TECHNOLOGY, INC.
1411 West River Road North, Minneapolis, MN, 55411
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
786015784
Principal Investigator:
Timothy childs
Research Director
(612) 341-2795
tim@tlcprecision.com
Business Contact:
Tim Childs
President
(612) 341-2795
tlc@tlcprecision.com
Research Institution:
n/a
Abstract
TLC has developed an innovative multi-component radiation hard InP HEMT based chip approach that will provide monolithic digital,millimter-wave and photnic functions for airborne, spaceborne and other military systems. During phase I we demonstrated lattice engineering, epi growth, design and device fabriction capabilities that resulted in high performance electronic and photonic devices using InP based HEMT structures. The electronic and photonic devices were engineered for various frequencies and wavelengths respectively. A transition layer was also demonstrated that will allow multi-devices to be developed and demonstrated on the same epi wafer. Therefore in Phase II, TLC will develop the multi-functio digital/photonic/ MMW circuits simulation, designs, fabrication testing and delivery.

* information listed above is at the time of submission.

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