Bandgap Engineered Rad-Hard Multi-Function Digital MMW/Photonic Circuits

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DTRA01-02-C-0092
Agency Tracking Number: 00-1112
Amount: $750,000.00
Phase: Phase II
Program: SBIR
Awards Year: 2004
Solicitation Year: 2000
Solicitation Topic Code: BMDO00-014
Solicitation Number: 2000.1
Small Business Information
1411 West River Road North, Minneapolis, MN, 55411
DUNS: 786015784
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: Y
Principal Investigator
 Timothy Childs
 Research Director
 (612) 341-2795
 tim@tlcprecision.com
Business Contact
 Tim Childs
Title: President
Phone: (612) 341-2795
Email: tlc@tlcprecision.com
Research Institution
N/A
Abstract
TLC has developed an innovative multi-component radiation hard InP HEMT based chip approach that will provide monolithic digital,millimter-wave and photnic functions for airborne, spaceborne and other military systems. During phase I we demonstrated lattice engineering, epi growth, design and device fabriction capabilities that resulted in high performance electronic and photonic devices using InP based HEMT structures. The electronic and photonic devices were engineered for various frequencies and wavelengths respectively. A transition layer was also demonstrated that will allow multi-devices to be developed and demonstrated on the same epi wafer. Therefore in Phase II, TLC will develop the multi-functio digital/photonic/ MMW circuits simulation, designs, fabrication testing and delivery.

* Information listed above is at the time of submission. *

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