Bandgap Engineered Rad-Hard Multi-Function Digital MMW/Photonic Circuits
Small Business Information
1411 West River Road North, Minneapolis, MN, 55411
AbstractTLC has developed an innovative multi-component radiation hard InP HEMT based chip approach that will provide monolithic digital,millimter-wave and photnic functions for airborne, spaceborne and other military systems. During phase I we demonstrated lattice engineering, epi growth, design and device fabriction capabilities that resulted in high performance electronic and photonic devices using InP based HEMT structures. The electronic and photonic devices were engineered for various frequencies and wavelengths respectively. A transition layer was also demonstrated that will allow multi-devices to be developed and demonstrated on the same epi wafer. Therefore in Phase II, TLC will develop the multi-functio digital/photonic/ MMW circuits simulation, designs, fabrication testing and delivery.
* information listed above is at the time of submission.