Radiation Hard Interceptor Components Test Methods for Missile Defense

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-08-C-0043
Agency Tracking Number: B073-014-0240
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2008
Solicitation Year: 2007
Solicitation Topic Code: MDA07-014
Solicitation Number: 2007.3
Small Business Information
TORCH TECHNOLOGIES, INC.
4035 Chris Drive, Suite C, Huntsville, AL, 35802
DUNS: 122515708
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Neil Miller
 Principal Investigator
 (256) 319-6000
 neil.miller@torchtechnologies.com
Business Contact
 Kenneth Lones
Title: Director of Contracts
Phone: (256) 319-6019
Email: kenneth.lones@torchtechnologies.com
Research Institution
N/A
Abstract
In our Phase I effort, we propose to develop a concept that addresses radiation hardening techniques for electro-optical sensor and electronics unit subsystems. This development will demonstrate feasibility of the concept to be incorporated into the BMDS architecture to provide reliable operation for its projected mission life. We will conduct research and analysis efforts to identify, investigate, and demonstrate unique electronics designs, test methods, and test hardware to mitigate the effects of radiation environments. This concept has merit to provide reliable operation of BMDS interceptors in perturbed environments consistent with high altitude nuclear bursts or prolonged natural space radiation. We will determine feasibility of inserting hardening and/or evaluating radiation hardened sensors using proposed concepts without significantly impacting sensor mass, cost and producibility. We will develop an experimental approach that demonstrates the radiation hardness capability of the concept. We will provide some initial modeling and analysis to support our conclusions. Our approach would be practical implementation with the existing Sensor HWIL capability to demonstrate our proposed concept.

* information listed above is at the time of submission.

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