Fusion Materials & Components, Subtopic a. Structural Materials & Insulating Coatings

Award Information
Agency: Department of Energy
Branch: N/A
Contract: N/A
Agency Tracking Number: 41713
Amount: $74,998.00
Phase: Phase I
Program: SBIR
Awards Year: 1998
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
TPL, Inc.
3921 Academy Parkway North, NE, Albuquerqu, NM, 87109
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Dr. Stuart T. Schwab
 Supervisor, Speciality
 (505) 342-4436
Business Contact
 Dr. William F. Hartman
Title: V.P., Advanced Technologies
Phone: (505) 342-4414
Research Institution
N/A
Abstract
50306-98-I Fusion Materials & Components, Subtopic a. Structural Materials & Insulating Coatings--TPL, Inc, 3921 Academy Parkway North, NE, Albuquerque, NM 87109-4416; (505) 342-4414 Dr. Stuart T. Schwab, Principal Investigator Dr. William F. Hartman, Business Official DOE Grant No. DE-FG03-98ER82697 Amount: $75,000 Current methods of producing silicon carbide fiber reinforced silicon carbide (SiC/SiC) composites are slow, costly, and do not yield sufficient thermal conductivity for fusion reactor applications. The most conductive SiC/SiC contains elemental silicon, which limits service temperature, and may not be compatible with a high radiation. Polymer infiltration/pyrolysis (PIP) processing is a new manufacturing method that, when combined with electromagnetic (EM) heating, can produce high thermal conductivity SiC/SiC rapidly and cheaply. In Phase I, PIP processing will be integrated with EM heating, and the EM-PIP process will be used to make SiC/SiC composites for testing under fusion service conditions. Commercial Applications and Other Benefits as described by the awardee: Commercial applications include aircraft, gas turbine engines, waste incinerators, and chemical process equipment. The EM-PIP process will reduce the cost of SiC/SiC to the point at which it can replace many metals in common applications._

* information listed above is at the time of submission.

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