A Magnetoresistive, Remote-Field Eddy-Current Probe for Use with the Boeing MAUS III Scanner

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 41012
Amount: $99,998.00
Phase: Phase I
Program: SBIR
Awards Year: 1998
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
3921 Academy Parkway North NE, Albuquerque, NM, 87109
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Eric S. Boltz, Phd
 (505) 342-4475
Business Contact
Phone: () -
Research Institution
N/A
Abstract
Remote-field eddy-current techniques offer a powerful tool for the detection of deeply-buried damage in aging aircraft. Coil -based system, however, have poop sensitivity to the low frequencies used in remote-field measurements. What is needed is a remote field probe that utilizes a superior low-frequency magnetic field sensor.TPL, in collaboration with Boeing and the National Institute of Standards and Technology (NIST), will design, build and field test a remote-field probe based on a magnetoresistive detector. The prototype will be integrated with Boeing's MAUS III System for field evaluation. Prototype performance will be compared with both conventional coil-based sensors and with advanced magnetoresistive eddy-current sensors. The results of these comparisons will serve as a quantitative assessment of the new technique. TPL has pioneered the development of advanced magnetoresistive sensors for NDE applications and has a proven track-record in the commercialization of new technologies. By teaming with NIST and the Boeing Company, TPL can utilized the most advanced magnetic sensors and integrate this new technology with a proven, widely-used scanning system to assess its real-world performance potential. The inclusion of data from both conventional and emerging technologies will provide an objective assessment of both the fundamental and realizable sensitivity limits of this new technique.

* Information listed above is at the time of submission. *

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