Novel Micro-Supercapacitors""

Award Information
Agency:
Department of Defense
Amount:
$69,999.00
Program:
SBIR
Contract:
DASG60-02-P-0080
Solitcitation Year:
N/A
Solicitation Number:
N/A
Branch:
Missile Defense Agency
Award Year:
2002
Phase:
Phase I
Agency Tracking Number:
02-0387
Solicitation Topic Code:
N/A
Small Business Information
Tpl, Inc.
3921 Academy Parkway North, NE, Albuquerque, NM, 87109
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
055145320
Principal Investigator
 Charles Lakeman
 Advanced Scientist
 (505) 344-6744
 clakeman@tplinc.com
Business Contact
 Harold Stoller
Title: President & CEO
Phone: (505) 344-6744
Email: hstoller@tplinc.com
Research Institution
N/A
Abstract
"There is a continuing revolution in micro-systems toward increased speed and capability combined with smaller size. As system sizes decrease, the need for power systems of similarly small physical size emerges as a critical need. MEMS batteries areavailable as surface area devices, but their capacity and power delivery capability are limited. Similarly, commercial supercapacitors exist, but these are component-scale devices with a large footprint. Therefore, to realize a comprehensive microscalepower system, a miniaturized supercapacitor that can deliver high power on demand is required.In the proposed effort, TPL will use soft lithography microcontact printing (¿CP), an additive process that can fabricate near-net-shape miniaturized structures from non-silicon materials, to build MEMS-scale supercapacitors for a volumetricelectrochemical energy source. ¿CP will enable micro-supercapacitors to be constructed using optimized materials for a high power-density device. In this way, miniaturization of the highest performance system will be realized.The PI has pioneered the use of soft lithography with non-silicon materials for advanced packaging and has excellent capabilities to achieve the project objectives. TRW Space & Electronics Group will consult on device requirements, design constraints,applications and system engineering to deliver a product suitable for immediate insertion into space and defense applications. Miniaturize

* information listed above is at the time of submission.

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