SBIR/STTR Phase II: Laser Direct-Writing Technique to Produce Integrated Optical Amplifier/Splitter

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$499,998.00
Award Year:
2002
Program:
SBIR
Phase:
Phase II
Contract:
n/a
Award Id:
58600
Agency Tracking Number:
0216288
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
3921 Academy Parkway North, NE, Albuquerque, NM, 87109
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Douglas Taylor
(505) 343-1797
djtaylor@tplinc.com
Business Contact:
() -
Research Institute:
n/a
Abstract
This Small Business Innovation Research (SBIR)Phase II project will continue the successful work from the Phase I project and develop integrated amplifier/splitters through laser direct writing of wet-chemically derived, erbium-doped coatings. Precursor solutions will be mixed on the molecular level to produce pure and homogeneous materials. Waveguide structures will be written into the erbium-doped fluoride coatings with a laser, which raises its index of refraction to confine light. The erbium-doped channel waveguides will be pumped with a 980 nm source to amplify 1550 nm signals. Markets in which integrated optical devices, such as amplified splitters, can be used total several $100 million. This device will expedite bringing fiber the last mile because it will replace the current serial arrangement of discrete splitters and amplifiers, which is bulky and expensive due to the number of components and interconnects. The proposed integration techniques will also enable optical integrated circuits and next-generation computing. Prototypes will be fabricated during Phase II. TPL has extensive experience in wet-chemical processing and demonstrated ability to commercialize its technologies. The PI is a pioneering researcher of laser-fired, sol-gel derived films. LightPath Technologies will assist TPL with device and marketing development.

* information listed above is at the time of submission.

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