Magnetic Field Imaging System for NDE of Subsurface Flaws on Aircraft""

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$99,998.00
Award Year:
2002
Program:
SBIR
Phase:
Phase I
Contract:
F09650-02-M-0417
Agency Tracking Number:
021XP-1387
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Tpl, Inc.
3921 Academy Parkway North, NE, Albuquerque, NM, 87109
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
055145320
Principal Investigator:
Tim Tiernan
Director
(505) 342-4488
ttiernan@tplinc.com
Business Contact:
Harold Stoller
President & CEO
(505) 342-4412
hstoller@tplinc.com
Research Institution:
n/a
Abstract
TPL proposes an entirely new form of imaging technology for NDE of metallic aircraft components. The imaging technology is based on an array of giant magnetoresistance (GMR) sensors that can produce high resolution images of hidden flaws, corrosion,missing parts, and other defects.Minute GMR sensors (1 to 100 ¿m) detect magnetic fields associated with eddy currents induced in the component being imaged. High spatial resolution images are achieved through the high density and small size of the sensors in the array, coupled with thehigh sensitivity, low noise, and fast response of the sensors.GMR sensors weigh less than one gram. They are very rugged (tested to over 100,000g,) low power (~3mW), high bandwidth (>1 GHz), and low cost. Sensor arrays can be fabricated on flexible PCBs with geometries that match those of critical areas that requireperiodic NDE. These versatile sensors are ideally suited to both automated and handheld NDE systems.A GMR sensor array, can produce high resolution images of second and third layer flaws. The images are intuitive to analyze, yet highly accurate concerning position and severity of a defect. TPL will develop functional GMR sensor arrays, and make magneticimages of defects in metallic parts. The proposed technology will find markets in the airline industry, manufacturing plants, transportation systems, electronics, aerospace, construction, and other industries.

* information listed above is at the time of submission.

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