High Energy Density Capacitive Power Source for Electromagnetic Aircraft Launch Systems

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$1,490,280.00
Award Year:
2004
Program:
SBIR
Phase:
Phase II
Contract:
N00178-04-C-1013
Agency Tracking Number:
N022-1361
Solicitation Year:
2002
Solicitation Topic Code:
N02-134
Solicitation Number:
2002.2
Small Business Information
TPL, INC.
3921 Academy Parkway North, NE, Albuquerque, NM, 87109
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
055145320
Principal Investigator:
Kirk Slenes
Program Manager
(505) 342-4437
kslenes@tplinc.com
Business Contact:
H. Stoller
President
(505) 344-6744
hstoller@tplinc.com
Research Institution:
n/a
Abstract
Advanced power systems for Future Naval Capability rely on capacitors as the first stage of pulsed power. Significant electrical energy is necessary to support a range of applications including electro-mechanical aircraft launch systems, EMALS. It is anticipated that each ship will require over one trillion joules of capacitor energy, estimated at over 1,000 m3 and 1,000 tons using current technology. As a result, advanced dielectrics that allow for increased capacitor energy density are necessary to ensure successful technology insertion. Recent Phase I results support potential for significantly reducing capacitor size and weight. Unique methods for assembling nano-size, high dielectric constant particles in a polymer matrix were developed. Measured properties of the structured composite support capability for amplifying the nano-particle's contribution to dielectric constant by over a factor of three while maintaining dielectric strength. Film capacitor's produced with the novel dielectric are anticipated to yield an energy density of over 8 J/cc. TPL proposes a Phase II program to demonstrate the performance of a structured nano-composite dielectric in a wound film capacitor. The material will be optimized for continuous film fabrication and use with `self-healing' metal electrodes. Processes will be developed for fabricating sub-scale capacitors and evaluated with respect to an EMALS application.

* information listed above is at the time of submission.

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