Integrated Power Sources for MEMS with Extended Mission Durations

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-04-M-2439
Agency Tracking Number: F041-188-1323
Amount: $99,996.00
Phase: Phase I
Program: SBIR
Awards Year: 2004
Solicitation Year: 2004
Solicitation Topic Code: AF04-188
Solicitation Number: 2004.1
Small Business Information
3921 Academy Parkway North, NE, Albuquerque, NM, 87109
DUNS: 055145320
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Charles D.E. Lakeman
 Principal Investigator
 (505) 342-4427
 clakeman@tplinc.com
Business Contact
 H. Stoller
Title: President & CEO
Phone: (505) 342-4412
Email: hstoller@tplinc.com
Research Institution
N/A
Abstract
TPL proposes to develop a small volume small footprint, high capacity power source for MEMS and microsystems with extended mission durations. The proposed approach will apply TPL's novel VOLUMETRIC (or 3-D) design for minimum footprint, minimum volume electrochemical devices to high energy density lithium ion (Li-ion) chemistry. The resulting Li-ion microbatteries will provide a rechargeable power source for stand-alone MEMS sensors and miniaturized wireless communications devices used in advanced Air Force systems such as Micro Air Deployed Munitions. These novel devices will be the first MEMS-scale Li-ion microbatteries that exploit 3-D geometries to maximize capacity. Li-ion batteries are attractive for defense and consumer applications because of their high energy density (400Wh/kg), high voltage (>3.5V), and their ability to be recharged (>500 cycles). Combined with TPL's patented volumetric supercapacitors, the proposed small form factor batteries will enable a minimum-volume, minimum weight power source. Such a power supply will be critical to realizing discrete minimum volume (covert) microsystems for extended lifetime missions. TPL has pioneered volumetric micro-electrochemical devices, and is uniquely qualified to ensure delivery of a micro-power supply that will support MEMS applications in both commercial and military markets.

* Information listed above is at the time of submission. *

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