Development of an Implant Isolation Process for Heterojunction Bipolar Transistors

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 32303
Amount: $749,884.00
Phase: Phase II
Program: SBIR
Awards Year: 1997
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
4401 Dayton-Xenia Rd., Dayton, OH, 45432
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Dr. Rabi Bhattacharya
 (513) 426-6900
Business Contact
Phone: () -
Research Institution
Heterojunction bipolar transistors (HBT) are attracting much interest in high speed device applications, especially where high efficiency and high power density operation are of interest. A key issue for the manufacturability of HBTs is electrical isolation of individual devices from each other. The major problem with HBT isolation is the thickness of the power device structure where it is desirable to have collector and sub-collector layers 1 um thick or more. Such thick structures create problems for conventional mesa and keV implant isolation schemes. UES proposes to develop implant isolation schemes involving multiple does MeV B+ and O+ implants. The formation of high resistivity regions in GaAs-AlGaAs HBT structures will be investigated for different implant schemes formulated on the basis of computer simulations. The leakage current, breakdown voltage and sheet resistance measurements will be performed to optimize the implant parameters such as energy and dose.

* Information listed above is at the time of submission. *

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