SBIR Phase I: An Innovative Method for Removing Resist from Wafers

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$100,000.00
Award Year:
2006
Program:
SBIR
Phase:
Phase I
Contract:
0611170
Award Id:
79531
Agency Tracking Number:
0611170
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
6923 Redbud Drive, P O Box 219, Manhattan, KS, 66505
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Hang Ji
Dr
(785) 293-4917
hji@unicopiers.com
Business Contact:
Sameer Madanshetty
Dr
(785) 532-2609
sameer@ksu.edu
Research Institution:
n/a
Abstract
This Small Business Innovation Research (SBIR) Phase I Project seeks to develop an innovative method for removing resist from semiconductor wafers. The Microcavitation Resist Remover will help enable the low-k integration critical to the next generation of faster chips. Microcavitation will be a mechanical removal process influenced by the mechanical properties of fracture rather than the chemical constitution of the resist. Resist stripping is a growing $3.7B market. The proposed Microcavitation Resist Remover and wafer cleaner succesfully overcomes a critical technological barrier facing the IC manufacturing industry today. Beyond the IC manufacturing industy, the Microcavitation Resist Remover will be critical in all areas where thin film removal is critical e.g., MEMS, PCB, optics, automotive (paint removal), and aerospace. More broadly, it will be an enabling technology for use in thin film processing. Microcavitation is a chemical free, environmentally friendly technology.

* information listed above is at the time of submission.

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