SBIR Phase I: CMP Slurry Monitor

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$100,000.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
0740982
Award Id:
88346
Agency Tracking Number:
0740982
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
6923 Redbud Drive, Manhattan, KS, 66503
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
080880557
Principal Investigator:
SameerMadanshetty
PhD
(785) 317-4949
sameer@uncopiers.com
Business Contact:
SameerMadanshetty
PhD
(785) 317-4949
sameer@uncopiers.com
Research Institute:
n/a
Abstract
This SBIR Phase I project is to develop a Chemical Mechanical Polishing (CMP) Slurry Monitor as a fully in-line, real-time, point of use instrument that will detect and disperse large agglomerates in the nanofine slurries used in IC manufacture. The monitor will not only detect scratch inducing agglomerates but will also attempt to destroy them. Successful development of the slurry monitor will improve yields and decrease costs for the semiconductor industry. The principles of induced microcavitation may find wide applications in liquid/particle processing. By detecting and destroying agglomerates improved processes and products will be enabled.

* information listed above is at the time of submission.

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