SBIR Phase II: An Innovative Method for Removing Resist from Wafers

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0750623
Agency Tracking Number: 0611170
Amount: $500,000.00
Phase: Phase II
Program: SBIR
Awards Year: 2008
Solicitation Year: N/A
Solicitation Topic Code: CT
Solicitation Number: NSF 05-605
Small Business Information
6923 Redbud Drive, Manhattan, KS, 66503
DUNS: 080880557
HUBZone Owned: Y
Woman Owned: Y
Socially and Economically Disadvantaged: Y
Principal Investigator
 Hang Ji
 PhD
 (785) 776-1036
 hji@uncopiers.com
Business Contact
 Hang Ji
Title: PhD
Phone: (785) 776-1036
Email: hji@uncopiers.com
Research Institution
N/A
Abstract
The Small Business Innovation Research (SBIR) Phase II project seeks to develop an innovative, environment friendly method for removing resist from semiconductor wafers. After every lithography step, and the following processing step, e.g., etching or ion implantation, the process-hardened resist must be stripped away and the wafer cleaned. Existing photoresist removal methods (plasma ashing and wet chemical stripping) are proving too aggressive for current state-of-the-art interconnect materials-they tend to degrade and damage low-k dielectrics and corrode copper; they are also detrimental to the delicate device structures. In this project the resist stripping and wafer cleaning are accomplished in a single process step through controlled microcavitation in ultrapure water with no damage to the underlying layers and features. Resist stripping is a growing $2.64B market. The proposed resist remover and wafer cleaner successfully overcome a critical technological barrier facing the IC manufacturing industry today. Beyond the IC manufacturing industry, the microcavitation based layer removal will find applications in all areas requiring controlled thin film removal,e.g., MEMS, PCB, optics, automotive (paint removal), and aerospace. This will be an enabling technology useful in thin film processing. Microcavitation is a chemical free, environmentally friendly technology.

* Information listed above is at the time of submission. *

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