Flexible and Conformal Environmental Barrier Technology for Displays

Award Information
Agency: Department of Defense
Branch: Army
Contract: W911QX-06-C-0017
Agency Tracking Number: A052-050-0234
Amount: $120,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solicitation Year: 2005
Solicitation Topic Code: A05-050
Solicitation Number: 2005.2
Small Business Information
375 Phillips Blvd, Ewing, NJ, 08618
DUNS: 963267893
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Anna Chwang
 Senior Scientisit
 (609) 671-0980
Business Contact
 Janice Mahon
Title: VP of Technology Commercialization
Phone: (609) 671-0980
Email: jkmahon@universaldisplay.com
Research Institution
The goal of this U.S. Army SBIR program is to develop a novel low cost, multi-layer thin film encapsulation system to enable the in-flex use of AMOLED displays. Universal Display Corporation (UDC) is developing advanced flexible OLED (FOLEDr) technology based on its proprietary high-efficiency phosphorescent OLED (PHOLEDT) and transparent OLED (TOLEDT) technologies. The development of a low stress plasma enhanced chemical vapor deposition (PECVD) flexible multilayer encapsulant, deposited in a single deposition chamber using a single precursor gas, in combination with UDC FOLED technology, is the best solution to meet the Army's flexible barrier requirements. These technologies should enable long lived rugged displays that can withstand repetitive flexing for a variety of mobile display applications, including truly roll-out displays, having long lifetime and low power consumption. In Phase 1 we propose to demonstrate extended lifetime PHOLED pixels on glass substrates using a multilayer PECVD grown encapsulant. In a Phase 1 option, this encapsulation process will be applied to top emission pixels. For a subsequent Phase 2 program, we will model the mechanical properties to further optimize and reduce stress in the multilayer stack, demonstrate flexible and low power consumption AMOLED displays on metal substrates, and evaluate the encapsulant flexibility.

* Information listed above is at the time of submission. *

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