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Thin Film Thermal Batteries

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15QKN-07-C-0039
Agency Tracking Number: A062-038-0304
Amount: $120,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: A06-038
Solicitation Number: 2006.2
Solicitation Year: 2006
Award Year: 2006
Award Start Date (Proposal Award Date): 2006-11-07
Award End Date (Contract End Date): 2007-05-07
Small Business Information
74 Batterson Park Road
Farmington, CT 06032
United States
DUNS: 003612603
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Jinxiang Dai
 Director R&D
 (860) 487-3838
Business Contact
 David Reisner
Title: President & CEO
Phone: (860) 678-7561
Research Institution

US Army seeks to develop thermal batteries that are lower in cost, improved in electrochemical performance, and can be made in three-dimensional shapes. Currently, thermal batteries are manufactured in low volume and not cost effective process. The major components, electrodes and electrolytes, are pressed pellets, which need extra thickness to avoid cracking and cannot be used for mass production. US Nanocorp, Inc. (“USN”) proposes a new film fabrication technique to make the sandwich three layer cells to address Army’s request for improvement on thermal battery production. In the new cell production techniques, anode film will be made via porous nickel thermal spray coating and loaded with Li-metal to form a Li-Ni (Fe) composite film with required solidity at thermal battery working temperature. Cathode and electrolyte/separator will be thermal sprayed serially on graphoil sheets and cut into required shape and size. The process is feasible for automation and mass production. Another advantage is that the proposed film/membrane can be cut to any shape and size without dimension limitation. This program is highly feasible with USN’s extensive experience on materials and thin film coatings combined with Advanced Thermal Batteries, Inc (“ATB”) thermal battery manufacture experience.

* Information listed above is at the time of submission. *

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