Non-Hermetic Electronic Encapsulant Materials

Award Information
Agency:
Department of Defense
Branch:
Army
Amount:
$109,877.00
Award Year:
2001
Program:
SBIR
Phase:
Phase I
Contract:
DAAH01-01-C-R074
Agency Tracking Number:
A002-1479
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
UTILITY DEVELOPMENT CORP.
112 Naylon Avenue, Livingston, NJ, 07039
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
067504134
Principal Investigator
 Harry Katz
 President
 (973) 994-4334
 udcliv@msn.com
Business Contact
 Harry Katz
Title: President
Phone: (973) 994-4334
Email: udcliv@msn.com
Research Institution
N/A
Abstract
Our main objective will be to investigate and develop an affordable, high performance organic material formulation and application/molding process that will significantly advance the state-of-the-art in current encapsulation material performance fornon-hermetic integrated circuits (ICs). The new encapsulants will be permeable to moisture and have controlled coefficient of thermal expansion (CTE) and modulus of elasticity properties that minimize stress between the printed circuit board (PCB)substrate and integrated circuit. Fillers will be used to improve thermal conductivity and reduce the thermal expansion coefficient. Additives will be used to improve the adhesion and fire retardance. The developed encapsulants will be tested by theencapsulation of small parts by UDC and testing by end users. At the end of Phase I, we will provide a report with results and conclusions, and a Phase II plan, schedule and cost estimate.This program will provide a high performance non-hermeticelectronic encapsulants. These encapsulants will improve the performance, lower the cost, and improve reliability of nearly all electronic components used in weapon systems. Encapsulants for microcircuits are urgently needed throughout the commercialsector as well as in defense. Examples include computers, cell phones, and all devices with microcircuits. This technology will provide lower cost and higher performance in all of these applications.

* information listed above is at the time of submission.

Agency Micro-sites

US Flag An Official Website of the United States Government