Non-Hermetic Electronic Encapsulant Materials

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$728,935.00
Award Year:
2002
Program:
SBIR
Phase:
Phase II
Contract:
DAAH01-02-C-R010
Agency Tracking Number:
A002-1479
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Utility Development Corp.
112 Naylon Avenue, Livingston, NJ, 07039
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
067504134
Principal Investigator:
Harry Katz
President
(973) 994-4334
udcliv@msn.com
Business Contact:
Harry Katz
President
(973) 994-4334
udcliv@msn.com
Research Institution:
n/a
Abstract
The main objective will be to optimize the non-hermetic encapsulants that were developed and tested in the Phase I program. The Phase II research will result in an increase of the thermal stability so that these encapsulants will be capable ofwithstanding temperatures at the 600F level. Formulations, components concentrations, application and curing methods will be fine tuned. Among tests to be conducted will be moisture permeability, adhesion, thermal stability, thermal coefficientof expansion, thermal conductivity and physical properties. We will encapsulate a large number of electronic parts and our screening test results will be verified by our subcontractors and independent test laboratories. We will providematerials and process specifications for the innovative materials and process that will be developed during the proposed program. At the end of Phase II, UDC will provide a detailed report that will include all work performed, resultant data,specifications and a Phase III production plan.

* information listed above is at the time of submission.

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